Heraeus to Showcase Thick Print Copper Paste at IMAPS 2014

– Industry Leader to have significant presence at the 47th Symposium on Microelectronics, displaying both products…

Future Touch Technologies Optimized by Heraeus and ITRI

Effective Partnership: Clevios(TM) PEDOT and the Industrial Technology Research Institute application know-how for the touch panel…

Extended Product Range and Technical Presentations at the SMT Hybrid Packaging 2014

Focusing on bonding wires and thick film pastes. Heraeus experts inform via tutorial and lecture. Heraeus…

Erweitertes Produktportfolio und Fachvorträge auf der SMT Hybrid Packaging 2014

Bonddrähte und Dickfilmpasten von Heraeus im Fokus des Messeauftritts. Experten von Heraeus informieren im Tutorial und…

Touching the Future With Transparent Electrode Materials

Heraeus Clevios(TM) Conductive Polymers at Touch Taiwan Exhibition, Taipei 28-30 August The Heraeus product range not…

Heraeus at LOPE-C – Touching the Future

New Clevios(TM) grades with low surface resistance to be introduced at LOPE-C conference and exhibition. Clevios(TM)…

Multi-touch technology using new transparent conductive films demonstrated at Phoenix FlexTech Alliance Conference

Heraeus integrates Clevios™PEDOT:PSS technology in capacitive touch screen controller Heraeus Conductive Polymers Division has announced a…

Clevios(TM) at the Lope-C

New Solvent Based Hole Injection Layer and Organic Solar Cell Materials from Heraeus. Clevios? advanced conductive…

Heraeus at Display Taiwan, Taipei, 19-21 June

Economic conductive materials for touch screen applications using invisible patterning technology from Clevios(TM) will be announced…

Clevios? at the Lope-C

New Solvent Based Hole Injection Layer and Organic Solar Cell Materials from Heraeus. Clevios? advanced conductive…