ERS appoints seasoned expert to fill new CSMO position

New Chief Sales and Marketing Officer at ERS electronic GmbH: Laurent Giai-Miniet (Source: Laurent Giai-Miniet) MUNICH,…

New generation of Debonders and Warpage Adjusters boosts productivity

MUNICH, April 20, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal…

ERS boosts productivity in FOWLP debonding and wafer testing

Semicon China: Hall W4, Booth 4143-1 ERS‘ debonding machines for FOWLP (Fan-out Wafer-Level Packaging) (Source: ERS…

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology (Source: ERS electronic GmbH) MUNICH, August 2, 2016 – ERS electronic GmbH,…

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

ERS at Semicon Japan 2015 MUNICH, December 2, 2015 – ERS electronic GmbH, technology leader in…

Fairchild Semiconductor startet Produktion auf 8″ Wafer-Fertigungslinie in Korea

Fab produziert Energiemanagementlösungen für den weltweiten Markt München – 9. Juli 2013 – Fairchild Semiconductor (NYSE:…

ERS introduces high-end chiller at Semicon West

ERS Electronic GmbH MUNICH, 1 July, 2013 – ERS electronic GmbH, the innovation leader for thermal…

ERS displays its innovative product spectrum at PSECE 2013 trade fair

ERS Electronic GmbH MUNICH, May 28, 2013 – ERS electronic GmbH, the innovation leader in the…

ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market

MUNICH – December 5, 2012 – One and half a year after its launch, ERS electronic…

ERS AirCool 3 (AC3) systems certified according to international safety standards

MUNICH – July 12, 2012 – ERS electronic GmbH, technology leader in the market for Thermal…